Interfacial delamination analysis on fan-out wafer-level package using finite element method

• 主要作者: Conversion, Ariel P.
• 格式: text
• 語言: English
• 出版: Animo Repository 2022
• 主題: Semiconductors—Packaging; Mechanical Engineering
• 在線閱讀: https://animorepository.dlsu.edu.ph/etdm_mecheng/11; https://animorepository.dlsu.edu.ph/cgi/viewcontent.cgi?article=1009&context=etdm_mecheng
• 機構: De La Salle University

Fan-out wafer-level packaging has now become one the most widely used approaches for microelectronic component system integration using system-in-package because of its potential packaging size and electrical performance advantages. It is typically manufactured by embedding the silicon chips with ep...