Thermal test effect on fan-out wafer level package strength

• Main Authors: Xu, Cheng, Zhong, Zhao Wei, Choi, W. K.
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2018
• Subjects: Curing; Electromagnetic Compatibility; DRNTU::Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/102486; http://hdl.handle.net/10220/47256
• Institution: Nanyang Technological University

Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a very small form factor and it is also a cost effective packaging solution. As fan-out wafer level package (FOWLP) is composed of various materials, the pro...