Thermal test effect on fan-out wafer level package strength

Thermal test effect on fan-out wafer level package strength

Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a very small form factor and it is also a cost effective packaging solution. As fan-out wafer level package (FOWLP) is composed of various materials, the pro...

Full description

Saved in:
Bibliographic Details
Main Authors: Xu, Cheng, Zhong, Zhao Wei, Choi, W. K.
Other Authors: School of Mechanical and Aerospace Engineering
Format: Conference or Workshop Item
Language:English
Published: 2018
Subjects:
Curing
Electromagnetic Compatibility
DRNTU::Engineering::Mechanical engineering
Online Access:https://hdl.handle.net/10356/102486
http://hdl.handle.net/10220/47256
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
Description
Summary:Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a very small form factor and it is also a cost effective packaging solution. As fan-out wafer level package (FOWLP) is composed of various materials, the proper structural design and material selection are essential to achieve reliability requirements. In this study, FOWLP material especially the epoxy molding compound (EMC) thermal properties are evaluated to understand the effect of thermal factors on EMC strength. The long term thermal test is applied and the EMC flexure strength increases significantly after the high temperature storage test.

Similar Items