Thermal test effect on fan-out wafer level package strength

• Main Authors: Xu, Cheng, Zhong, Zhao Wei, Choi, W. K.
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2018
• Subjects: Curing; Electromagnetic Compatibility; DRNTU::Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/102486; http://hdl.handle.net/10220/47256
• Institution: Nanyang Technological University

Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a very small form factor and it is also a cost effective packaging solution. As fan-out wafer level package (FOWLP) is composed of various materials, the proper structural design and material selection are essential to achieve reliability requirements. In this study, FOWLP material especially the epoxy molding compound (EMC) thermal properties are evaluated to understand the effect of thermal factors on EMC strength. The long term thermal test is applied and the EMC flexure strength increases significantly after the high temperature storage test.