Finite element analysis of active metal braised semiconductor package for warpage reduction
Warpage is considered as a major concern in semiconductor packaging devices due to possible reliability and functionality failures. With the miniaturization of the electronic devices with the simultaneous increased functionality makes the new electronic devices susceptible to quality and reliability...
Saved in:
| Main Author: | |
|---|---|
| Format: | text |
| Language: | English |
| Published: |
Animo Repository
2022
|
| Subjects: | |
| Online Access: | https://animorepository.dlsu.edu.ph/etdm_mecheng/10 https://animorepository.dlsu.edu.ph/cgi/viewcontent.cgi?article=1010&context=etdm_mecheng |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | De La Salle University |
| Language: | English |