Finite element analysis of active metal braised semiconductor package for warpage reduction

• المؤلف الرئيسي: Moran, Roberto Louis P.
• التنسيق: text
• اللغة: English
• منشور في: Animo Repository 2022
• الموضوعات: Semiconductors—Packaging; Semiconductors—Defects; Mechanical Engineering
• الوصول للمادة أونلاين: https://animorepository.dlsu.edu.ph/etdm_mecheng/10; https://animorepository.dlsu.edu.ph/cgi/viewcontent.cgi?article=1010&context=etdm_mecheng
• المؤسسة: De La Salle University

Warpage is considered as a major concern in semiconductor packaging devices due to possible reliability and functionality failures. With the miniaturization of the electronic devices with the simultaneous increased functionality makes the new electronic devices susceptible to quality and reliability...