Moran, R. L. P. (2022). Finite element analysis of active metal braised semiconductor package for warpage reduction. Animo Repository.
Chicago Style CitationMoran, Roberto Louis P. Finite Element Analysis of Active Metal Braised Semiconductor Package for Warpage Reduction. Animo Repository, 2022.
MLA CitationMoran, Roberto Louis P. Finite Element Analysis of Active Metal Braised Semiconductor Package for Warpage Reduction. Animo Repository, 2022.
Warning: These citations may not always be 100% accurate.