Interfacial delamination analysis on fan-out wafer-level package using finite element method
Fan-out wafer-level packaging has now become one the most widely used approaches for microelectronic component system integration using system-in-package because of its potential packaging size and electrical performance advantages. It is typically manufactured by embedding the silicon chips with ep...
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| Format: | text |
| Language: | English |
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Animo Repository
2022
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| Online Access: | https://animorepository.dlsu.edu.ph/etdm_mecheng/11 https://animorepository.dlsu.edu.ph/cgi/viewcontent.cgi?article=1009&context=etdm_mecheng |
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| Institution: | De La Salle University |
| Language: | English |