Numerical and experimental study of interface delamination in flip chip BGA package

10.1115/1.4001145

Saved in:
Bibliographic Details
Main Authors: Guojun, H., Tay, A.A.O., Jing-En, L., Yiyi, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
CTE
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85495
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore