Numerical and experimental study of interface delamination in flip chip BGA package

• Main Authors: Guojun, H., Tay, A.A.O., Jing-En, L., Yiyi, M.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Article
• 出版: 2014
• 主題: Chemical cure shrinkage; CTE; Flip chip BGA package; Interface delamination; MVCCM
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/85495
• 機構: National University of Singapore

10.1115/1.4001145