Numerical and experimental study of interface delamination in flip chip BGA package

Numerical and experimental study of interface delamination in flip chip BGA package

10.1115/1.4001145

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Bibliographic Details
Main Authors: Guojun, H., Tay, A.A.O., Jing-En, L., Yiyi, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Chemical cure shrinkage
CTE
Flip chip BGA package
Interface delamination
MVCCM
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85495
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Institution: National University of Singapore
Description
Summary:10.1115/1.4001145

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