Numerical and experimental study of interface delamination in flip chip BGA package

Numerical and experimental study of interface delamination in flip chip BGA package

10.1115/1.4001145

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Bibliographic Details
Main Authors: Guojun, H., Tay, A.A.O., Jing-En, L., Yiyi, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Chemical cure shrinkage
CTE
Flip chip BGA package
Interface delamination
MVCCM
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85495
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-854952023-10-26T21:19:50Z Numerical and experimental study of interface delamination in flip chip BGA package Guojun, H. Tay, A.A.O. Jing-En, L. Yiyi, M. MECHANICAL ENGINEERING Chemical cure shrinkage CTE Flip chip BGA package Interface delamination MVCCM 10.1115/1.4001145 Journal of Electronic Packaging, Transactions of the ASME 132 1 0110061-0110067 JEPAE 2014-10-07T09:08:40Z 2014-10-07T09:08:40Z 2010-03 Article Guojun, H., Tay, A.A.O., Jing-En, L., Yiyi, M. (2010-03). Numerical and experimental study of interface delamination in flip chip BGA package. Journal of Electronic Packaging, Transactions of the ASME 132 (1) : 0110061-0110067. ScholarBank@NUS Repository. https://doi.org/10.1115/1.4001145 10437398 http://scholarbank.nus.edu.sg/handle/10635/85495 000275825100006 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Chemical cure shrinkage
CTE
Flip chip BGA package
Interface delamination
MVCCM
spellingShingle Chemical cure shrinkage
CTE
Flip chip BGA package
Interface delamination
MVCCM
Guojun, H.
Tay, A.A.O.
Jing-En, L.
Yiyi, M.
Numerical and experimental study of interface delamination in flip chip BGA package
description 10.1115/1.4001145
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Guojun, H.
Tay, A.A.O.
Jing-En, L.
Yiyi, M.
format Article
author Guojun, H.
Tay, A.A.O.
Jing-En, L.
Yiyi, M.
author_sort Guojun, H.
title Numerical and experimental study of interface delamination in flip chip BGA package
title_short Numerical and experimental study of interface delamination in flip chip BGA package
title_full Numerical and experimental study of interface delamination in flip chip BGA package
title_fullStr Numerical and experimental study of interface delamination in flip chip BGA package
title_full_unstemmed Numerical and experimental study of interface delamination in flip chip BGA package
title_sort numerical and experimental study of interface delamination in flip chip bga package
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/85495
_version_ 1781784687675441152

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