A new modified crack surface displacement extrapolation method for analysis of package delamination

by Guojun, H., Tay, A.A.O.
Published 2014

A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow

by Guojun, H., Tay, A.A.O.
Published 2014

On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow

by Guojun, H., Tay, A.A.O.
Published 2014

A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow

by Guojun, H.H., Tay, A.A.O., Yongwei, Z., Chew, S.
Published 2014

Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics?

by Guojun, H., Jing-En, L., Baraton, X., Tay, A.A.O.
Published 2014

Numerical and experimental study of interface delamination in flip chip BGA package

by Guojun, H., Tay, A.A.O., Jing-En, L., Yiyi, M.
Published 2014