On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow
Proceedings - Electronic Components and Technology Conference
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| Main Authors: | , |
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| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/86045 |
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| Institution: | National University of Singapore |