On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow

On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow

Proceedings - Electronic Components and Technology Conference

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Main Authors: Guojun, H., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86045
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-860452024-11-13T13:23:15Z On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow Guojun, H. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 1 172-178 PECCA 2014-10-07T09:15:14Z 2014-10-07T09:15:14Z 2005 Conference Paper Guojun, H.,Tay, A.A.O. (2005). On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow. Proceedings - Electronic Components and Technology Conference 1 : 172-178. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/86045 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description Proceedings - Electronic Components and Technology Conference
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Guojun, H.
Tay, A.A.O.
format Conference or Workshop Item
author Guojun, H.
Tay, A.A.O.
spellingShingle Guojun, H.
Tay, A.A.O.
On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow
author_sort Guojun, H.
title On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow
title_short On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow
title_full On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow
title_fullStr On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow
title_full_unstemmed On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow
title_sort on the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic ic package during lead-free solder reflow
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/86045
_version_ 1821216215753818112

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