Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading

• Main Authors: Ho, S.L., Joshi, S.P., Tay, A.A.O.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Coefficient of thermal expansion mismatch; Cohesive zone model (CZM); Delamination; Delamination initiation; Delamination propagation; Electronics packaging; Encapsulant; Failure analysis; Failure pattern; Finite element methods (FEMs); Fracture mechanics; Interface fracture; Interfacial fracture energy; Quad flat no leads (QFN) package; Reliability; Stress concentration thermal stress; Thermomechanical stress
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/60262
• Institution: National University of Singapore

10.1109/TCPMT.2013.2266406