Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading

10.1109/TCPMT.2013.2266406

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Bibliographic Details
Main Authors:	Ho, S.L., Joshi, S.P., Tay, A.A.O.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Coefficient of thermal expansion mismatch Cohesive zone model (CZM) Delamination Delamination initiation Delamination propagation Electronics packaging Encapsulant Failure analysis Failure pattern Finite element methods (FEMs) Fracture mechanics Interface fracture Interfacial fracture energy Quad flat no leads (QFN) package Reliability Stress concentration thermal stress Thermomechanical stress
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60262
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-60262
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spelling	sg-nus-scholar.10635-602622023-10-26T08:36:49Z Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading Ho, S.L. Joshi, S.P. Tay, A.A.O. MECHANICAL ENGINEERING Coefficient of thermal expansion mismatch Cohesive zone model (CZM) Delamination Delamination initiation Delamination propagation Electronics packaging Encapsulant Failure analysis Failure pattern Finite element methods (FEMs) Fracture mechanics Interface fracture Interfacial fracture energy Quad flat no leads (QFN) package Reliability Stress concentration thermal stress Thermomechanical stress 10.1109/TCPMT.2013.2266406 IEEE Transactions on Components, Packaging and Manufacturing Technology 3 11 1859-1867 2014-06-17T06:21:07Z 2014-06-17T06:21:07Z 2013 Article Ho, S.L., Joshi, S.P., Tay, A.A.O. (2013). Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading. IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (11) : 1859-1867. ScholarBank@NUS Repository. https://doi.org/10.1109/TCPMT.2013.2266406 21563950 http://scholarbank.nus.edu.sg/handle/10635/60262 000328506100008 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Coefficient of thermal expansion mismatch Cohesive zone model (CZM) Delamination Delamination initiation Delamination propagation Electronics packaging Encapsulant Failure analysis Failure pattern Finite element methods (FEMs) Fracture mechanics Interface fracture Interfacial fracture energy Quad flat no leads (QFN) package Reliability Stress concentration thermal stress Thermomechanical stress
spellingShingle	Coefficient of thermal expansion mismatch Cohesive zone model (CZM) Delamination Delamination initiation Delamination propagation Electronics packaging Encapsulant Failure analysis Failure pattern Finite element methods (FEMs) Fracture mechanics Interface fracture Interfacial fracture energy Quad flat no leads (QFN) package Reliability Stress concentration thermal stress Thermomechanical stress Ho, S.L. Joshi, S.P. Tay, A.A.O. Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading
description	10.1109/TCPMT.2013.2266406
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Ho, S.L. Joshi, S.P. Tay, A.A.O.
format	Article
author	Ho, S.L. Joshi, S.P. Tay, A.A.O.
author_sort	Ho, S.L.
title	Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading
title_short	Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading
title_full	Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading
title_fullStr	Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading
title_full_unstemmed	Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading
title_sort	experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60262
_version_	1781781801367240704

Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading

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