Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading
10.1109/TCPMT.2013.2266406
Saved in:
| Main Authors: | , , |
|---|---|
| 其他作者: | |
| 格式: | Article |
| 出版: |
2014
|
| 主題: | |
| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/60262 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 機構: | National University of Singapore |
| id |
sg-nus-scholar.10635-60262 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-602622024-11-13T13:23:07Z Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading Ho, S.L. Joshi, S.P. Tay, A.A.O. MECHANICAL ENGINEERING Coefficient of thermal expansion mismatch Cohesive zone model (CZM) Delamination Delamination initiation Delamination propagation Electronics packaging Encapsulant Failure analysis Failure pattern Finite element methods (FEMs) Fracture mechanics Interface fracture Interfacial fracture energy Quad flat no leads (QFN) package Reliability Stress concentration thermal stress Thermomechanical stress 10.1109/TCPMT.2013.2266406 IEEE Transactions on Components, Packaging and Manufacturing Technology 3 11 1859-1867 2014-06-17T06:21:07Z 2014-06-17T06:21:07Z 2013 Article Ho, S.L., Joshi, S.P., Tay, A.A.O. (2013). Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading. IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (11) : 1859-1867. ScholarBank@NUS Repository. https://doi.org/10.1109/TCPMT.2013.2266406 21563950 http://scholarbank.nus.edu.sg/handle/10635/60262 000328506100008 Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| topic |
Coefficient of thermal expansion mismatch Cohesive zone model (CZM) Delamination Delamination initiation Delamination propagation Electronics packaging Encapsulant Failure analysis Failure pattern Finite element methods (FEMs) Fracture mechanics Interface fracture Interfacial fracture energy Quad flat no leads (QFN) package Reliability Stress concentration thermal stress Thermomechanical stress |
| spellingShingle |
Coefficient of thermal expansion mismatch Cohesive zone model (CZM) Delamination Delamination initiation Delamination propagation Electronics packaging Encapsulant Failure analysis Failure pattern Finite element methods (FEMs) Fracture mechanics Interface fracture Interfacial fracture energy Quad flat no leads (QFN) package Reliability Stress concentration thermal stress Thermomechanical stress Ho, S.L. Joshi, S.P. Tay, A.A.O. Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading |
| description |
10.1109/TCPMT.2013.2266406 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Ho, S.L. Joshi, S.P. Tay, A.A.O. |
| format |
Article |
| author |
Ho, S.L. Joshi, S.P. Tay, A.A.O. |
| author_sort |
Ho, S.L. |
| title |
Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading |
| title_short |
Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading |
| title_full |
Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading |
| title_fullStr |
Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading |
| title_full_unstemmed |
Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading |
| title_sort |
experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/60262 |
| _version_ |
1821225746426757120 |