Experiments and three-dimensional modeling of delamination in an encapsulated microelectronic package under thermal loading

• المؤلفون الرئيسيون: Ho, S.L., Joshi, S.P., Tay, A.A.O.
• مؤلفون آخرون: MECHANICAL ENGINEERING
• التنسيق: مقال
• منشور في: 2014
• الموضوعات: Coefficient of thermal expansion mismatch; Cohesive zone model (CZM); Delamination; Delamination initiation; Delamination propagation; Electronics packaging; Encapsulant; Failure analysis; Failure pattern; Finite element methods (FEMs); Fracture mechanics; Interface fracture; Interfacial fracture energy; Quad flat no leads (QFN) package; Reliability; Stress concentration thermal stress; Thermomechanical stress
• الوصول للمادة أونلاين: http://scholarbank.nus.edu.sg/handle/10635/60262

10.1109/TCPMT.2013.2266406