UV/H2O2 oxidation process optimization by response surface methodology for removal of polycyclic aromatic hydrocarbons (PAHs) from water

by Malakahmad, A., Ho, L.L.H.
Published 2017

State entrapment

by Ho, H.L.
Published 2013

Comparative observations on the burden of proof for criminal defences

by Ho, H.L.
Published 2013

Similar facts in civil cases

by Ho, H.L.
Published 2013

What does a verdict do? A speech act analysis of giving a verdict

by Ho, H.L.
Published 2013

Human prolactin

by Cheah, J.S., Ho, C.L.
Published 2016

Analysis of repairable system failure data using time series models

by Xie, M., Ho, S.L.
Published 2014

The use of ARIMA models for reliability forecasting and analysis

by Ho, S.L., Xie, M.
Published 2014

Effects of ultrashort laser pulses on angular distributions of photoionization spectra

by Raymond Ooi, C.H., Ho, W.L., Bandrauk, A.D.
Published 2017

High frequency plant regeneration from mature seed of elite, recalcitrant Malaysian indica rice (Oryza sativa l.) CV. MR 219

by Sivakumar, P., Law, Y.S., Ho, C. L., Harikrishna, J.A.
Published 2010

Development of bio-health products from rice bran ferulates

by Bagalkotkar, Gururaj, Ismail, Maznah, Ho, K. L., R., Nur Hazwani
Published 2008

Postoperative imaging of complications following cranial implants

by Ho, C.L., McAdory, L.
Published 2021

Process monitoring strategies for surface mount manufacturing processes

by Ho, S.-L., Xie, M., Goh, T.-N.
Published 2014

"Middling" Chinese Returnees or Immigrants from Canada? The Ambiguity of Return Migration and Claims to Modernity

by Ho, E.L.-E., Ley, D.
Published 2016

Ocular surface status in glaucoma and ocular hypertension patients with existing corneal disorders switched from latanoprost 0.005% to tafluprost 0.0015%: comparison of two prostag...

by Wong, T.T, Aung, T, Ho, C.L
Published 2020

Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration

by Tay, A.A.O., Ho, S.L.
Published 2014

Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages

by Ho, S.L., Tay, A.A.O.
Published 2014

3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages

by Ho, S.L., Tay, A.A.O.
Published 2014

A numerical analysis of penny-shaped delaminations in an encapsulated silicon module

by Ho, S.L., Tay, A.A.O.
Published 2014

A numerical study of 3D interfacial delamination in PQFP packages

by Ho, S.L., Tay, A.A.O.
Published 2014