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 ______     _____     _  __    _____    __   _   
|      \\  |  ___||  | |/ //  |  ___|| | || | || 
|  --  //  | ||__    | ' //   | ||__   | '--' || 
|  --  \\  | ||__    | . \\   | ||__   | .--. || 
|______//  |_____||  |_|\_\\  |_____|| |_|| |_|| 
`------`   `-----`   `-` --`  `-----`  `-`  `-`

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Text this: A finite element study of stresses developed in plastic encapsulated electronic packages during leadframe pull-out testing