A finite element study of stresses developed in plastic encapsulated electronic packages during leadframe pull-out testing

• المؤلف الرئيسي: Ng, Shioo Wat.
• مؤلفون آخرون: Yi, Sung
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/13412
• المؤسسة: Nanyang Technological University

The objective of this project is to simulate the stresses developed in the epoxy encapsulated dummy integrated circuit package during leadframe pull-out testing. Finite element analyses are utilized to simulate the stresses developed due to free and constrained displacement boundary conditions, the...