Thermal stress analysis of electronic packaging components

The stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints o...

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Bibliographic Details
Main Author:	See Toh, Chee Wai.
Other Authors:	Pang, John Hock Lye
Format:	Theses and Dissertations
Language:	English
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Online Access:	http://hdl.handle.net/10356/13448
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University
Language:	English

id	sg-ntu-dr.10356-13448
record_format	dspace
spelling	sg-ntu-dr.10356-134482023-03-11T17:28:25Z Thermal stress analysis of electronic packaging components See Toh, Chee Wai. Pang, John Hock Lye School of Mechanical and Production Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging The stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints of a CBGA package were studied. Master of Engineering (MPE) 2008-08-29T08:08:39Z 2008-10-20T08:18:39Z 2008-08-29T08:08:39Z 2008-10-20T08:18:39Z 1998 1998 Thesis http://hdl.handle.net/10356/13448 en 107 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
language	English
topic	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging See Toh, Chee Wai. Thermal stress analysis of electronic packaging components
description	The stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints of a CBGA package were studied.
author2	Pang, John Hock Lye
author_facet	Pang, John Hock Lye See Toh, Chee Wai.
format	Theses and Dissertations
author	See Toh, Chee Wai.
author_sort	See Toh, Chee Wai.
title	Thermal stress analysis of electronic packaging components
title_short	Thermal stress analysis of electronic packaging components
title_full	Thermal stress analysis of electronic packaging components
title_fullStr	Thermal stress analysis of electronic packaging components
title_full_unstemmed	Thermal stress analysis of electronic packaging components
title_sort	thermal stress analysis of electronic packaging components
publishDate	2008
url	http://hdl.handle.net/10356/13448
_version_	1761781768035237888

Thermal stress analysis of electronic packaging components

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