Noise coupling analysis in integrated circuit packaging

The fast evolution of technology in electronics industry towards higher speed and density forces the integrated circuit (IC) packaging performance to its limits. A set of design rules for fine signal integrity (SI) performance in the integrated circuit is necessary due to the shorter transition time...

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Bibliographic Details
Main Author: Fernandus, Wylie
Other Authors: See Kye Yak
Format: Final Year Project
Language:English
Published: 2015
Subjects:
Online Access:http://hdl.handle.net/10356/62066
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Institution: Nanyang Technological University
Language: English

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