Finite element modeling and simulation of solder interconnection system

• Main Author: Chandra, William.
• Other Authors: Pang Hock Lye, John
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/17128
• Institution: Nanyang Technological University

This final year project is consisted of three studies to facilitate the author to assess solder joint reliability in different electronic packages using finite element methods In the first study, the impact of different constitutive material on PBGA thermal reliability is investigated. One eight...