Finite element modeling and simulation of solder interconnection system

This final year project is consisted of three studies to facilitate the author to assess solder joint reliability in different electronic packages using finite element methods In the first study, the impact of different constitutive material on PBGA thermal reliability is investigated. One eight...

Full description

Saved in:
Bibliographic Details
Main Author: Chandra, William.
Other Authors: Pang Hock Lye, John
Format: Final Year Project
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/17128
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English

Similar Items