Investigation of nano-copper for electronic packaging application : solder metallization and die attach
Nano-copper (NC) has been developed recently with good potential for electronic packaging applications. In this work, the interfacial reaction between NC and Sn-3.5Ag and the adhesion between NC and different metallizations were investigated. Thermal Gravimetric Analysis (TGA) results of NC paste we...
Saved in:
Main Author: | |
---|---|
Other Authors: | |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2016
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/66939 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |