Investigation of nano-copper for electronic packaging application : solder metallization and die attach

Nano-copper (NC) has been developed recently with good potential for electronic packaging applications. In this work, the interfacial reaction between NC and Sn-3.5Ag and the adhesion between NC and different metallizations were investigated. Thermal Gravimetric Analysis (TGA) results of NC paste we...

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Bibliographic Details
Main Author: Luo, Kaiming
Other Authors: Gan Chee Chip
Format: Theses and Dissertations
Language:English
Published: 2016
Subjects:
Online Access:https://hdl.handle.net/10356/66939
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Institution: Nanyang Technological University
Language: English