Investigation of nano-copper for electronic packaging application : solder metallization and die attach

• Main Author: Luo, Kaiming
• Other Authors: Gan Chee Chip
• Format: Theses and Dissertations
• Language: English
• Published: 2016
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: https://hdl.handle.net/10356/66939
• Institution: Nanyang Technological University

Nano-copper (NC) has been developed recently with good potential for electronic packaging applications. In this work, the interfacial reaction between NC and Sn-3.5Ag and the adhesion between NC and different metallizations were investigated. Thermal Gravimetric Analysis (TGA) results of NC paste we...