Study on low temperature indium based solder for 3D integrated circuits application

Due to limitations of the conventional 2-dimensional integrated circuit (IC) layout, the electronics industry has shifted its research focus towards 3-dimensional (3D) ICs design to overcome such future problems. A common 3D ICs architecture that has been proposed involves the stacking of multiple c...

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Bibliographic Details
Main Author: Tee, Joel Han Yun.
Other Authors: Gan Chee Lip
Format: Final Year Project
Language:English
Published: 2010
Subjects:
Online Access:http://hdl.handle.net/10356/38702
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Institution: Nanyang Technological University
Language: English