Study on low temperature indium based solder for 3D integrated circuits application

• Main Author: Tee, Joel Han Yun.
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: http://hdl.handle.net/10356/38702
• Institution: Nanyang Technological University

Due to limitations of the conventional 2-dimensional integrated circuit (IC) layout, the electronics industry has shifted its research focus towards 3-dimensional (3D) ICs design to overcome such future problems. A common 3D ICs architecture that has been proposed involves the stacking of multiple c...