Electrical characterization of indium-tin based solder materials

• المؤلف الرئيسي: Aw, Jie Li
• مؤلفون آخرون: Gan Chee Lip
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering::Materials::Electronic packaging materials
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/44032

Interests in low temperature “green” solder has been increasing with the complexity of electronics. The low processing temperature meant lower damage to the active layers, which in turn promises better reliability. However, with an increasingly wide range of applications for electronics, comes a...