Electrical characterization of indium-tin based solder materials

• Main Author: Aw, Jie Li
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: http://hdl.handle.net/10356/44032
• Institution: Nanyang Technological University

Interests in low temperature “green” solder has been increasing with the complexity of electronics. The low processing temperature meant lower damage to the active layers, which in turn promises better reliability. However, with an increasingly wide range of applications for electronics, comes a different set of problems for each application. The optimized solution is customization, but existing traditional means of research is too arduous and slow. Hence to reduce time in this search for a suitable solder, combinatorial methodology is adapted to accelerate the speed of research. Indium-based alloys have been documented to have low melting points, and through the adapted combinatorial methodology, the electrical characteristics of the different compositions are explored. This project concludes that the morphological properties affect the resistivity of deposited solder as it approaches thinner dimensions. Morphology‟s effects should be understood clearly to create a reliable model that can be used to effectively discount the morphological effects on resistivity, or another testing structure could be developed that would be morphological independent, yet allowing the ease of testing.