Electrical characterization of indium-tin based solder materials

• Main Author: Aw, Jie Li
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: http://hdl.handle.net/10356/44032
• Institution: Nanyang Technological University

Interests in low temperature “green” solder has been increasing with the complexity of electronics. The low processing temperature meant lower damage to the active layers, which in turn promises better reliability. However, with an increasingly wide range of applications for electronics, comes a...