Optimisation of the ultrafast high sintering process for NanoCu particles bonding

• Main Author: Koh, Clifford Sin Yuen
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2022
• Subjects: Engineering::Materials::Electronic packaging materials
• Online Access: https://hdl.handle.net/10356/157120
• Institution: Nanyang Technological University

To support the harsh environment of power electronics, such as high operating temperature, and high current density, the advancement in package and assembly technology of the modules is critical. The objective of this study is to develop an optimised ultrafast high temperature sintering (UHS) proces...