Optimisation of the ultrafast high sintering process for NanoCu particles bonding

• 主要作者: Koh, Clifford Sin Yuen
• 其他作者: Gan Chee Lip
• 格式: Final Year Project
• 語言: English
• 出版: Nanyang Technological University 2022
• 主題: Engineering::Materials::Electronic packaging materials
• 在線閱讀: https://hdl.handle.net/10356/157120
• 機構: Nanyang Technological University

To support the harsh environment of power electronics, such as high operating temperature, and high current density, the advancement in package and assembly technology of the modules is critical. The objective of this study is to develop an optimised ultrafast high temperature sintering (UHS) proces...