Copper interconnect by filtered cathodic vacuum arc technique

• Main Authors: Lau, Daniel Shu Ping, Tay, Beng Kang, Shi, Xu
• Other Authors: School of Electrical and Electronic Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/2884
• Institution: Nanyang Technological University

This project discussed the copper interconnect by filtered cathodic vacuum arc technique.