Copper interconnect by filtered cathodic vacuum arc technique

This project discussed the copper interconnect by filtered cathodic vacuum arc technique.

Saved in:

Bibliographic Details
Main Authors:	Lau, Daniel Shu Ping, Tay, Beng Kang, Shi, Xu
Other Authors:	School of Electrical and Electronic Engineering
Format:	Research Report
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Online Access:	http://hdl.handle.net/10356/2884
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-2884
record_format	dspace
spelling	sg-ntu-dr.10356-28842023-03-04T03:24:08Z Copper interconnect by filtered cathodic vacuum arc technique Lau, Daniel Shu Ping Tay, Beng Kang Shi, Xu School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging This project discussed the copper interconnect by filtered cathodic vacuum arc technique. RG 41/99 2008-09-17T09:16:16Z 2008-09-17T09:16:16Z 2003 2003 Research Report http://hdl.handle.net/10356/2884 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Lau, Daniel Shu Ping Tay, Beng Kang Shi, Xu Copper interconnect by filtered cathodic vacuum arc technique
description	This project discussed the copper interconnect by filtered cathodic vacuum arc technique.
author2	School of Electrical and Electronic Engineering
author_facet	School of Electrical and Electronic Engineering Lau, Daniel Shu Ping Tay, Beng Kang Shi, Xu
format	Research Report
author	Lau, Daniel Shu Ping Tay, Beng Kang Shi, Xu
author_sort	Lau, Daniel Shu Ping
title	Copper interconnect by filtered cathodic vacuum arc technique
title_short	Copper interconnect by filtered cathodic vacuum arc technique
title_full	Copper interconnect by filtered cathodic vacuum arc technique
title_fullStr	Copper interconnect by filtered cathodic vacuum arc technique
title_full_unstemmed	Copper interconnect by filtered cathodic vacuum arc technique
title_sort	copper interconnect by filtered cathodic vacuum arc technique
publishDate	2008
url	http://hdl.handle.net/10356/2884
_version_	1759857254395281408

Copper interconnect by filtered cathodic vacuum arc technique

Similar Items