Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects
56 p.
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Published: |
2010
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/39142 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |