Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects

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Bibliographic Details
Main Author: Anson Heryanto
Other Authors: Pey Kin Leong
Format: Theses and Dissertations
Published: 2010
Subjects:
Online Access:http://hdl.handle.net/10356/39142
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Institution: Nanyang Technological University
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