Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects

56 p.

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Bibliographic Details
Main Author:	Anson Heryanto
Other Authors:	Pey Kin Leong
Format:	Theses and Dissertations
Published:	2010
Subjects:	DRNTU::Engineering::Electrical and electronic engineering
Online Access:	http://hdl.handle.net/10356/39142
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-39142
record_format	dspace
spelling	sg-ntu-dr.10356-391422023-07-04T15:30:19Z Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects Anson Heryanto Pey Kin Leong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering 56 p. Consistent improvements in integrated circuit density and performance have been amply demonstrated over the past 20 years by using transistor scaling, a model for simultaneously improving transistor density, performance, functionality and cost per function. In the transistor scaling sub-micron technology, the fact showed that interconnect delay starts to dominate the gate delay. Copper was introduced as a primary interconnect material in integrated circuit in 1997 by IBM due to its lower resistivity than aluminum. Master of Science (Microelectronics) 2010-05-21T04:45:37Z 2010-05-21T04:45:37Z 2007 2007 Thesis http://hdl.handle.net/10356/39142 application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering Anson Heryanto Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects
description	56 p.
author2	Pey Kin Leong
author_facet	Pey Kin Leong Anson Heryanto
format	Theses and Dissertations
author	Anson Heryanto
author_sort	Anson Heryanto
title	Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects
title_short	Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects
title_full	Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects
title_fullStr	Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects
title_full_unstemmed	Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects
title_sort	three-dimensional (3d) finite element modeling of stress distribution and migration in cu interconnects
publishDate	2010
url	http://hdl.handle.net/10356/39142
_version_	1772826063065317376

Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects

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