Impacts of bends and ground return vias on interconnects for high speed GHz designs

• Main Authors: Chang, Richard Weng Yew, See, Kye Yak, Tan, Yang Long
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: https://hdl.handle.net/10356/91031; http://hdl.handle.net/10220/6386
• Institution: Nanyang Technological University

In the past only critical clock circuits are running at high speed but this is no longer true in today high-speed digital...