Impacts of bends and ground return vias on interconnects for high speed GHz designs

• المؤلفون الرئيسيون: Chang, Richard Weng Yew, See, Kye Yak, Tan, Yang Long
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: 2010
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/91031; http://hdl.handle.net/10220/6386
• المؤسسة: Nanyang Technological University

In the past only critical clock circuits are running at high speed but this is no longer true in today high-speed digital...