Impacts of bends and ground return vias on interconnects for high speed GHz designs

In the past only critical clock circuits are running at high speed but this is no longer true in today high-speed digital...

Full description

Saved in:
Bibliographic Details
Main Authors: Chang, Richard Weng Yew, See, Kye Yak, Tan, Yang Long
Other Authors: School of Electrical and Electronic Engineering
Format: Conference or Workshop Item
Language:English
Published: 2010
Subjects:
Online Access:https://hdl.handle.net/10356/91031
http://hdl.handle.net/10220/6386
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
Description
Summary:In the past only critical clock circuits are running at high speed but this is no longer true in today high-speed digital design world. Most of the digital traces on board are running at speed in excess of 200 MHz and drivers output with rise time less than 1 ns. Due to constraints of board size and highly complex designs, trace bends and inter-layer transitions through vias are unavoidable. This paper carries out a comprehensive study on the impacts of bends and ground return vias optimisation on signal integrity performance using a full-wave electromagnetic simulator. (CST Microwave Studio). This study will provide high-speed digital designers an in-depth assessment of these effects in high-speed GHz applications so that some design guides to avoid these effects can be established.