Noise coupling analysis in integrated circuit packaging

• Main Author: Fernandus, Wylie
• Other Authors: See Kye Yak
• Format: Final Year Project
• Language: English
• Published: 2015
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/62066
• Institution: Nanyang Technological University

The fast evolution of technology in electronics industry towards higher speed and density forces the integrated circuit (IC) packaging performance to its limits. A set of design rules for fine signal integrity (SI) performance in the integrated circuit is necessary due to the shorter transition time, faster clock rate and harsher environmental conditions. The term Signal Integrity refers to the signal’s quality that have to be maintained and controlled for the receiving end in the electronic design to achieve its goal. At the lower frequencies, the transmission lines may be considered as an ideal circuit which refers to the negligible of the impedance, capacitance, or inductance value. On the other hand, at the higher frequencies, the value of the impedance, capacitance, and inductance are significant on the transmission lines. It is due to the alternating current (AC) circuit characteristics. The impedance of the transmission line is exceptionally significant, as if any mismatch on the transmission line, the quality of the signal will be affected negatively. The mismatch of the impedance causes the energy of the transmitted signal that does not entirely absorb by the receiver to be reflected back to the transmitter. This process will be repeated until all of the energy is absorbed by the receiver. Therefore, signal overshoot, undershoot, and ringing waveforms due to the high data rates will happen which referred as signal errors.