Noise coupling analysis in integrated circuit packaging

• Main Author: Fernandus, Wylie
• Other Authors: See Kye Yak
• Format: Final Year Project
• Language: English
• Published: 2015
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/62066
• Institution: Nanyang Technological University

The fast evolution of technology in electronics industry towards higher speed and density forces the integrated circuit (IC) packaging performance to its limits. A set of design rules for fine signal integrity (SI) performance in the integrated circuit is necessary due to the shorter transition time...