Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading

by Lim, Niño Rigo Emil G., Ubando, Aristotle T., Gonzaga, Jeremias A., Dimagiba, Richard Raymond N.
Published 2020

FEA of thermal warpage in ball grid array with consideration of molding compound residual strain compared to experimental measurements

by Lim, Niño Rigo Emil G., Dimagiba, Richard, Ubando, Aristotle T., Gonzaga, Jeremias, Augusto, Gerardo L.
Published 2019

Reduction of IC package warpage through finite element analysis and direct optimization

by Moran, Roberto Louis, Arriola, Emmanuel, Emil Lim, Nino Rigo, Mercado, John Patrick, Dimagiba, Richard, Gonzaga, Jeremias, Ubando, Aristotle T.
Published 2019

Evaluation of the Effects of Introducing Channels to Composite Materials to Reduce Warpage on Semiconductor Packages Due to Coefficient of Thermal Expansion Mismatch

by Arriola, Emmanuel, Emil Lim, Nino Rigo, Louis Moran, Roberto, Mercado, John Patrick, Dimagiba, Richard, Gonzaga, Jeremias, Ubando, Aristotle T.
Published 2019

Material properties sensitivity analysis based on thermomechanical analysis on warpage for ball grid array semiconductor packaging

by Lim, Niño Rigo Emil G., Arriola, Emmanuel, Moran, Roberto Louis, Mercado, John Patrick, Dimagiba, Richard, Gonzaga, Jeremias, Ubando, Aristotle T.
Published 2019