Reduction of IC package warpage through finite element analysis and direct optimization

by Moran, Roberto Louis, Arriola, Emmanuel, Emil Lim, Nino Rigo, Mercado, John Patrick, Dimagiba, Richard, Gonzaga, Jeremias, Ubando, Aristotle T.
Published 2019

Evaluation of the Effects of Introducing Channels to Composite Materials to Reduce Warpage on Semiconductor Packages Due to Coefficient of Thermal Expansion Mismatch

by Arriola, Emmanuel, Emil Lim, Nino Rigo, Louis Moran, Roberto, Mercado, John Patrick, Dimagiba, Richard, Gonzaga, Jeremias, Ubando, Aristotle T.
Published 2019