Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects

10.1109/TCAPT.2008.2004602

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Bibliographic Details
Main Authors:	Cheong, W.G., Chew, H.B., Guo, T.F., Cheng, L.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Finite-element analysis Interfacial adhesion Micromechanical damage Moisture sensitivity Package reliability
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/86807
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-86807
record_format	dspace
spelling	sg-nus-scholar.10635-868072024-11-11T04:51:58Z Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects Cheong, W.G. Chew, H.B. Guo, T.F. Cheng, L. MECHANICAL ENGINEERING MATERIALS SCIENCE AND ENGINEERING Finite-element analysis Interfacial adhesion Micromechanical damage Moisture sensitivity Package reliability 10.1109/TCAPT.2008.2004602 IEEE Transactions on Components and Packaging Technologies 32 1 12-19 ITCPF 2014-10-07T09:55:02Z 2014-10-07T09:55:02Z 2009 Article Cheong, W.G., Chew, H.B., Guo, T.F., Cheng, L. (2009). Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects. IEEE Transactions on Components and Packaging Technologies 32 (1) : 12-19. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2008.2004602 15213331 http://scholarbank.nus.edu.sg/handle/10635/86807 000263928700002 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Finite-element analysis Interfacial adhesion Micromechanical damage Moisture sensitivity Package reliability
spellingShingle	Finite-element analysis Interfacial adhesion Micromechanical damage Moisture sensitivity Package reliability Cheong, W.G. Chew, H.B. Guo, T.F. Cheng, L. Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects
description	10.1109/TCAPT.2008.2004602
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Cheong, W.G. Chew, H.B. Guo, T.F. Cheng, L.
format	Article
author	Cheong, W.G. Chew, H.B. Guo, T.F. Cheng, L.
author_sort	Cheong, W.G.
title	Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects
title_short	Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects
title_full	Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects
title_fullStr	Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects
title_full_unstemmed	Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects
title_sort	thermomechanical analysis of plastic ball grid arrays with vapor pressure effects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/86807
_version_	1821195001969770496

Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects

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