Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach

Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach

Advances in Electronic Packaging

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Bibliographic Details
Main Authors: Chong, C.W., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE
Format: Conference or Workshop Item
Published: 2014
Subjects:
Computational cell elements
Interface delamination
Moisture sensitivity test
Moisture-induced damage
Void Growth
Online Access:http://scholarbank.nus.edu.sg/handle/10635/74001
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Institution: National University of Singapore
id sg-nus-scholar.10635-74001
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spelling sg-nus-scholar.10635-740012024-11-11T04:52:12Z Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach Chong, C.W. Guo, T.F. Cheng, L. MATERIALS SCIENCE MECHANICAL ENGINEERING Computational cell elements Interface delamination Moisture sensitivity test Moisture-induced damage Void Growth Advances in Electronic Packaging 1 391-397 2014-06-19T05:41:56Z 2014-06-19T05:41:56Z 2003 Conference Paper Chong, C.W.,Guo, T.F.,Cheng, L. (2003). Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach. Advances in Electronic Packaging 1 : 391-397. ScholarBank@NUS Repository. 0791836908 http://scholarbank.nus.edu.sg/handle/10635/74001 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Computational cell elements
Interface delamination
Moisture sensitivity test
Moisture-induced damage
Void Growth
spellingShingle Computational cell elements
Interface delamination
Moisture sensitivity test
Moisture-induced damage
Void Growth
Chong, C.W.
Guo, T.F.
Cheng, L.
Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach
description Advances in Electronic Packaging
author2 MATERIALS SCIENCE
author_facet MATERIALS SCIENCE
Chong, C.W.
Guo, T.F.
Cheng, L.
format Conference or Workshop Item
author Chong, C.W.
Guo, T.F.
Cheng, L.
author_sort Chong, C.W.
title Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach
title_short Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach
title_full Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach
title_fullStr Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach
title_full_unstemmed Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach
title_sort vapor pressure assisted interface delamination and failure of plastic ic packages - a micromechanics approach
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/74001
_version_ 1821214801604378624

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