Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach

• Main Authors: Chong, C.W., Guo, T.F., Cheng, L.
• Other Authors: MATERIALS SCIENCE
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Computational cell elements; Interface delamination; Moisture sensitivity test; Moisture-induced damage; Void Growth
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/74001
• Institution: National University of Singapore

Advances in Electronic Packaging