SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES

Master's

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Main Author: CHIN CHIAM CHUANG
Other Authors: SINGAPORE-MIT ALLIANCE
Format: Theses and Dissertations
Published: 2019
Subjects:
Online Access:https://scholarbank.nus.edu.sg/handle/10635/154028
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-1540282019-05-10T13:16:16Z SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES CHIN CHIAM CHUANG SINGAPORE-MIT ALLIANCE LI YI ZHOU WEI moisture diffusivity saturated moisture concentration coefficient of moisture expansion hygroscopic swelling thermal expansion vapor pressure interface delamination Master's MASTER OF SCIENCE IN ADVANCED MATERIALS FOR MICRO- & NANO- SYSTEMS 2019-05-10T07:27:44Z 2019-05-10T07:27:44Z 2003 Thesis CHIN CHIAM CHUANG (2003). SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/154028 SMA BATCHLOAD 20190422
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
topic moisture diffusivity
saturated moisture concentration
coefficient of moisture expansion
hygroscopic swelling
thermal expansion
vapor pressure
interface delamination
spellingShingle moisture diffusivity
saturated moisture concentration
coefficient of moisture expansion
hygroscopic swelling
thermal expansion
vapor pressure
interface delamination
CHIN CHIAM CHUANG
SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
description Master's
author2 SINGAPORE-MIT ALLIANCE
author_facet SINGAPORE-MIT ALLIANCE
CHIN CHIAM CHUANG
format Theses and Dissertations
author CHIN CHIAM CHUANG
author_sort CHIN CHIAM CHUANG
title SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
title_short SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
title_full SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
title_fullStr SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
title_full_unstemmed SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
title_sort simulation and characterization on moisture sensitivity performance for electronic packages
publishDate 2019
url https://scholarbank.nus.edu.sg/handle/10635/154028
_version_ 1681099327671369728