SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES

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Bibliographic Details
Main Author:	CHIN CHIAM CHUANG
Other Authors:	SINGAPORE-MIT ALLIANCE
Format:	Theses and Dissertations
Published:	2019
Subjects:	moisture diffusivity saturated moisture concentration coefficient of moisture expansion hygroscopic swelling thermal expansion vapor pressure interface delamination
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/154028
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-1540282024-10-26T00:14:09Z SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES CHIN CHIAM CHUANG SINGAPORE-MIT ALLIANCE LI YI ZHOU WEI moisture diffusivity saturated moisture concentration coefficient of moisture expansion hygroscopic swelling thermal expansion vapor pressure interface delamination Master's MASTER OF SCIENCE IN ADVANCED MATERIALS FOR MICRO- & NANO- SYSTEMS Dissertation Advisor: 1. Associate Professor Li Yi, SMA Faculty Fellow, Singapore (NUS). 2. Dr Zhou Wei, Principal Engineer, R&D Team, Micron Semiconductor Asia, Singapore. 2019-05-10T07:27:44Z 2019-05-10T07:27:44Z 2003 Thesis CHIN CHIAM CHUANG (2003). SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/154028 SMA BATCHLOAD 20190422
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	moisture diffusivity saturated moisture concentration coefficient of moisture expansion hygroscopic swelling thermal expansion vapor pressure interface delamination
spellingShingle	moisture diffusivity saturated moisture concentration coefficient of moisture expansion hygroscopic swelling thermal expansion vapor pressure interface delamination CHIN CHIAM CHUANG SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
description	Master's
author2	SINGAPORE-MIT ALLIANCE
author_facet	SINGAPORE-MIT ALLIANCE CHIN CHIAM CHUANG
format	Theses and Dissertations
author	CHIN CHIAM CHUANG
author_sort	CHIN CHIAM CHUANG
title	SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
title_short	SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
title_full	SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
title_fullStr	SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
title_full_unstemmed	SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
title_sort	simulation and characterization on moisture sensitivity performance for electronic packages
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/154028
_version_	1821232239577399296

SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES

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