Advances in vapor pressure modeling for electronic packaging
10.1109/TADVP.2006.879423
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Main Authors: | Wong, E.H., Koh, S.W., Lee, K.H., Lim, K.-M., Lim, T.B., Mai, Y.-W. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/59392 |
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Institution: | National University of Singapore |
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