Popcorn failure and unstable void growth in plastic electronic packages

Popcorn failure and unstable void growth in plastic electronic packages

Key Engineering Materials

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Bibliographic Details
Main Authors: Chong, C.W., Guo, T.F., Cheng, L.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
FEA
IC packages
Multiaxial straining
Popcorn failure
Unstable void growth
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73763
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/73763

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