Popcorn failure and unstable void growth in plastic electronic packages

• Main Authors: Chong, C.W., Guo, T.F., Cheng, L.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: FEA; IC packages; Multiaxial straining; Popcorn failure; Unstable void growth
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73763
• Institution: National University of Singapore

Key Engineering Materials